Packaging Innovation 2019 Warsaw
Dear Customers, Visit us at the Packaging Innovation Fair, which will be held on the 2nd-3rd April 2019 in Warsaw. There will be plenty of great attractions waiting for our clients.
You will have the opportunity to check out our virtual shelf, where we will present our new packaging. In addition, we will present you our new application AR. Thanks to the app we will combine reality with the virtual world. Feel invited!
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